Ƙarfafa da Ƙarfafa da Ɗaukar

1.Kabinan kashe aTZa ta iya hana wafer ko kuma ƙwaya a cikin halin buɗe, ’ Yan’uwa za su iya samun ƙanƙana da kuma ɓawwa ta wajen sadaukar a matsa.

2.Karin N2Za ta iya guje wa kansa na fiber K zinariya, kayayyaki da ware zinariya na Bonding, ƙarfafa da sauran ƙarƙawa da wasu nasu.

3.?Kabinett mai tsananiZa ta iya hana "rtsun zariya" da aka jawo ta wurin ɓaɓɓen PCB kafin aikin SMT.

4.Ƙarfafa waferZai iya hana a tsanani na ciki na ƙwarai na IC (haɗa da QFP / BGA / CSP) da daidai da wasu cikinsu a lokacin adana, da kuma abu na ƙarfi, raɓe da kuma delamination, da kuma "popcorn" a waje a lokacin a wasa.

5. An yi amfani da su a wuraren chip da yawa a faɗin aikin chip. Aikin akwati na karɓan karɓa ita ce ya ƙunshi IC, chip, TFT-LCD substrate, K zinariya mai aiki da zahiri mai adar ƙarfin muffle jama'a, wato na zinariya, ƙarfafa, PCB substrate, daidai.

Ku aika a email zuwa sales@dry-cabinet.cn ko kuma a ziyara sarautarmu.Https://www.dry-cabinet.cnDon ƙarin bayani.