Isicelo seKhabhinethi yomileyo kwishishini le-SMT

Izinto ezibonakalayo：25928

Iinkcukacha zenqaku

I-Mount Technology (i-Surface Mount Technology) yitekhnoloji ye-elektroniki esebenzisa izixhobo zobungcali ezizenzekelayo, njengomatshini wokushicilela i-solder paste, umatshini wokubeka, ukuhamba kwakhona kwewelding, njl. Izinto zomdibaniso we-weld (iintlobo zibandakanya izixhobo, i-capacitors, iinductors, njl. kumphezulu webhodi yesekethe. Ikhompyuter, ifowuni yeselfowuni, umshicileli, MP4, umfanekiso wedijithali, inkqubo yolawulo lobuchwephesha obuphezulu kunye nomsebenzi onamandla konke kuveliswa zizixhobo ze-SMT, Itekhnoloji eyintloko yemveliso ye-elektroniki yanamhlanje.
Uninzi lweemveliso ze-elektroniki zifuna ukusebenza kunye nokugcinwa phantsi kweemeko ezomileyo. Ngokweenkcukacha-manani, ngaphezulu kwe-1/4 iimveliso ezilahliweyo zehlabathi minyaka le zinxulumene nomonakalo wokufuma. Kumzi mveliso we-elektroniki, umonakalo wokufuma uye waba yenye yezona zinto ziphambili zolawulo lomgangatho wemveliso.
Kwishishini le-semiconductor, ukufuma kunokungena kwiphakheji yeplastiki ye-IC kwaye kuhlasele i-IC ngaphakathi kwisikhewu esifana nepin, ikhokelela kwimeko yokufunxa ukufuma kwe-IC. Kwiinkqubo zokufudumeza i-SMT, ukufuma okungena ngaphakathi kwe-IC kuyafudumeza kwaye kwandiswe ukwenza umphunga wamanzi, kwaye uxinzelelo olukhoyo lubangela ukuba iphakheji ye-ic resin iqhekeke, kwaye isinyithi ngaphakathi kwesixhobo sifakwe i-oxidized, ekhokelela ekusileleni kwemveliso.
Ngapha koko, xa izinto zikwinkqubo yokuwela kwiibhodi zePCB, iya kukhokelela kwi-welding ebonakalayo ngenxa yokukhutshwa koxinzelelo lomphunga wamanzi. Ngokomgangatho weJ-STD-033, Izinto ze-SMT emva kokuvezwa kokufuma okuphezulu komoya kufuneka zibekwe kwikhabhinethi yomisa ngombane engaphantsi kwe-10% RH Amaxesha ali-10 ixesha lokuvezwa ukubuyisela "ubomi beworkshop" bezinto ukunqanda ukukhupha kunye nokuqinisekisa ukhuseleko.

Ububi bubangele iingxaki ezinzulu kulawulo lomgangatho kunye nokuthembeka kweemveliso kwishishini le-elektroniki ekufuneka zomiswe ngokwe-IPC-M19 0 imigangatho.
I-chip iya kuboniswa inqanaba elithile elibuthaka xa lishiya umzi-mveliso. Enye indlela ebalulekileyo kumgangatho we-IPC kukucacisa ukufuma okufunekayo ukugcina i-chip kwinqanaba layo elihambelanayo.
Ukugcinwa kokufuma kwechip, kukho imigangatho emibini: 10% RH ngezantsi kunye ne-5% RH ngezantsi kwekhabhinethi eyomileyo, nguthotho oluqhelekileyo olusetyenzisiweyo kwii-chips eziqhelekileyo. "I-MSD engatshintshiweyo, inokubuyiselwa kubomi be-workshop obusetyenziswe yile MSD ngexesha lama-5 okanye ali-10 amaxesha okugcina ukufuma okuchaziweyo (e. g. 10 RH okanye ngaphantsi) xa ixesha lokuvezwa lingagqithi kweeyure ezingama-72. ” Ixesha lokubonakaliswa lixesha apho i-MSD ibekwa kwindawo yokufuma ephezulu emva kokuvalelwa.
Ukufuya kuye kwaba yenye yezona zinto ziphambili zolawulo lomgangatho wemveliso kumzi mveliso we-SMT. Ukufuma kokugcina iimveliso ze-SMT kungaphantsi kwe-40%, ezinye zifuna ukufuma okuphantsi. Ukugcinwa kwezinto ezinobuchule bokufuma kuye kwaba yintloko kubo bonke abavelisi be-EMS. Emva kokufunxa ukufuma kwezinto ze-elektroniki kunye neebhodi zesekethe, kulula ukuvelisa i-welding ebonakalayo, ezikhokelela ekunyukeni kweemveliso ezilahliweyo. Nangona inokuphuculwa emva kokubhaka kunye nokupheliswa, ukusebenza kwezinto zincipha emva kokubhaka, ezichaphazela ngokuthe ngqo umgangatho weemveliso.
IiKhabhinethi zomileyo ze-ERJERInokulungisa zonke iingxaki ezinxulumene nokufuma, yamkele imibuzo!

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